AI Chip Market Growth: Why RFQ and BOM Planning Should Start Earlier

TSMC raised its long-term global chip market forecast as AI drives growth, while Foxconn reported stronger profit on AI product demand. Buyers should prepare RFQ and BOM details earlier.

AI is becoming one of the strongest long-term drivers of semiconductor demand. TSMC raised its forecast for the global chip market and now expects the market to reach about $1.5 trillion by 2030, with artificial intelligence as a major growth driver.

Foxconn also reported stronger first-quarter profit, supported by demand for AI products and AI server rack shipments. For electronics buyers, these updates show that AI demand is no longer limited to a small group of headline processors. It can influence memory, power devices, connectors, sensors, advanced packaging, PCB-related materials and other supporting BOM lines.

When AI server, data center and high-performance computing projects absorb more capacity, standard components may also face changing lead times, shorter quotation validity or stronger competition for available stock. This is why RFQ and BOM planning should start earlier, especially for production-critical components.

Procurement teams should prepare RFQ information clearly before sending an inquiry. A complete request should include manufacturer part number, quantity, target price, required delivery schedule, preferred brand, required date code or year, acceptable alternatives and BOM file if available.

JZP Components supports RFQ follow-up and BOM review for ICs, MCUs, MOSFETs, IGBTs, connectors, sensors, passive components, obsolete parts and hard-to-find components. Early RFQ submission helps reduce quotation delays and improves the chance of finding stable supply options before production becomes urgent.

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